12 Lakabka FR4 ENIG Xakamaynta Saamaynta PCB

1. guddiga wareegga PCBsi loo tixgeliyo gelinta iyo rakibidda qaybaha elektaroonigga ah, gelinta dambe ee SMT patch waxay sidoo kale u baahan tahay in la tixgeliyo dhaqdhaqaaqa iyo gudbinta signalka iyo arrimaha kale, sidaas darteed waxay u baahan doontaa xannibaadda sida ugu hooseeya ee suurtogalka ah.

2. guddiga PCB ee habka wax soo saarka ee dhigaalka naxaasta, daasadda daasada (ama daarista electroless, daasadda buufin kulul), alxanka iyo hababka kale, alaabta loo isticmaalo waa in ay u baahan resistivity hoose, si loo hubiyo in qiimaha impedance guud ee guddiga wareegga si ay u buuxi shuruudaha tayada alaabta, si ay si caadi ah ugu shaqeeyaan.

3. PCB daasadda daasadda guddiga wareegga waa ugu nugul in dhibaatooyinka soo saarka guddiga wareegga oo dhan, waa isku xirka muhiimka ah ee saameeya impedance;ciladdeeda ugu weyn waa oksaydhism fudud ama deliquescence, brazing liidata, si guddiga wareegga waa adag tahay in la iibiyo, impedance waa mid aad u sarreeya, taasoo keentay in conductivity liidata ama waxqabadka aan degganayn ee guddiga oo dhan.

4. kaari in guddiga wareegga PCB yeelan doonaan noocyo kala duwan oo gudbinta signal, line laftiisa ay sabab u tahay etching, dhumucdiisuna laminate, width silig iyo arrimo kale, waxay keeni doontaa isbedel qiimaha impedance, ka dhigi qallooca signal, taasoo keentay in waxqabadka guddiga wareegga ayaa hoos u dhacaya, markaa waa lagama maarmaan in la xakameeyo qiimaha impedance ee xad gaar ah.