computer-repair-london

Qalabka Isgaarsiinta

Qalabka Isgaarsiinta PCB

Si loo gaabiyo fogaanta gudbinta ishaarada oo loo yareeyo khasaaraha gudbinta calaamadaha, guddiga isgaarsiinta 5G.

Talaabo talaabo u gudub fiilooyinka cufnaanta sare, kala dheeraynta fiilada, twaxa uu jihada horumarinta ee micro-aperture, nooca khafiif ah iyo isku halaynta sare.

Si qoto-dheer u wanaajinta tignoolajiyada wax-soo-saarka iyo habka wax-soo-saarka saxanka iyo wareegyada, oo dhaafsiisan caqabadaha farsamada.Noqo soo-saare heer sare ah oo 5G ah guddiga isgaadhsiinta PCB ee dhamaadka-sare.

PCB电路板线路板生产加工制造厂家汇和电路通信设备

Warshadaha Isgaadhsiinta Iyo Alaabta PCB

Warshadaha isgaarsiinta Qalabka ugu muhiimsan Alaabta PCB ee loo baahan yahay PCB feature
 

Shabakadda wireless-ka

 

Saldhig isgaarsiineed

Diyaaradda dhabarka, loox-xawaaraha sare leh, looxa microwave-ka-soo noqnoqda, substrate bir ah oo hawl badan  

Saldhig bir ah, cabbir weyn, multilayer sare, qalabka soo noqnoqda sare iyo danab isku dhafan  

 

 

Shabakadda gudbinta

Qalabka gudbinta OTN, qalabka gudbinta mikrowave diyaarad dhabarka, looxa multilayer-xawaaraha sare leh, looxa microwave-soo noqnoqda sare Diyaaradda dhabarka, loox-xawaaraha sare leh ee looxa badan, looxa mikrowave-sare ee soo noqnoqda  

Qalabka xawaaraha sare leh, cabbir weyn, multilayer sare, cufnaanta sare, laydhka dhabarka, isku-dhafka dabacsan, walxaha soo noqnoqda sare iyo cadaadis isku dhafan

Isgaarsiinta xogta  

Jidadka, furayaasha, adeegga / kaydinta Devic

 

Diyaarad-dambe, loox-lakabyo badan oo xawaare sare leh

Waxyaalaha xawaaraha sare leh, cabbir weyn, lakabyo badan oo sarreeya, cufnaanta sare, laydhka dhabarka, isku-dhafka qallafsan
Broadband network go'an  

OLT, ONU iyo qalabka kale ee fiber-to-the-guriga

Waxyaalaha xawaaraha sare leh, cabbir weyn, lakabyo badan oo sarreeya, cufnaanta sare, laydhka dhabarka, isku-dhafka qallafsan  

Multilay

PCB ee Qalabka Isgaarsiinta iyo Terminalka Mobilka

Qalabka Isgaarsiinta

Gole keli ah / double
%
4 lakab
%
6 lakab
%
8-16 lakab
%
ka sarreeya 18 lakab
%
HDI
%
PCD dabacsan
%
Substrate xirmo
%

Terminalka mobilada

Gole keli ah / double
%
4 lakab
%
6 lakab
%
8-16 lakab
%
ka sarreeya 18 lakab
%
HDI
%
PCD dabacsan
%
Substrate xirmo
%

Geedi socodka adag ee soo noqnoqda sare iyo xawaaraha sare PCB Board

Qodob adag Caqabadaha
Saxnaanta toosinta Saxnaanta ayaa ka sii adag, isla markaana isku toosintu waxay u baahan tahay isu-dulqaadasho.Isku dhafka noocaan ah ayaa aad u adag marka cabbirka saxanka uu isbedelo
STUB (joojinta caqabada ah) STUB-gu wuu adag yahay, dhumucda saxanka ayaa ah mid aad u dhib badan, waxaana loo baahan yahay farsamada dib u qodista
 

saxnaanta impedance

Waxaa jira caqabad weyn oo ku wajahan xoqidda: 1. Qodobbada xoqidda: inta yar ayaa ka wanaagsan, dulqaadka saxnaanta etching waxaa xakameynaya +/-1MIL ee miisaanka 10mil iyo wixii ka hooseeya, iyo +/-10% dulqaadka fidsan ee ka sarreeya 10mil.2. Shuruudaha ballaca xariiqa, fogaanta xariiqda iyo dhumucda xariiqda ayaa ka sarreeya.3. Kuwo kale: cufnaanta fiilooyinka, faragelinta ishaarada
Baahida loo qabo luminta ishaarada oo kordhay Waxaa jira caqabad weyn oo ku wajahan daaweynta dusha sare ee dhammaan laminatesyada naxaasta ah;dulqaad sare ayaa looga baahan yahay dhumucda PCB, oo ay ku jiraan dhererka, ballaca, dhumucda, toosnaanta, qaansada iyo qallooca, iwm.
Cabbirku wuu sii weynaanayaa Mashiinku wuu ka sii darayaa, maneuverability wuu sii xumaanayaa, godka indha la'aanta ayaa loo baahan yahay in la aaso.Qiimaha ayaa kordha2. Saxnaanta toosinta ayaa aad u adag
Tirada lakabyada ayaa noqda mid sarreeya Astaamaha khadadka cufan iyo via, cabbirka unugga weyn iyo lakabka dielectric khafiif ah, iyo shuruudo aad u adag oo loogu talagalay meel bannaan oo gudaha ah, isku toosinta dhexda, xakamaynta impedance iyo isku halaynta

Waayo-aragnimada La Urursaday ee Soo saarista Guddida Isgaarsiinta ee Wareegyada HUIHE

Shuruudaha cufnaanta sare:

Saamaynta hadalka isdhaafka (sanqadha) ayaa hoos u dhici doonta hoos u dhaca khadka / kala dheereynta.

Shuruudaha caqabada adag:

Isbarbardhigga isbarbardhigga dabeecadda ayaa ah shuruudaha aasaasiga ah ee looxa mikrowave inta jeer ee sarreeya.Markasta oo ay sii weynaato xannibaadda, taas oo ah, awoodda weyn ee looga hortagayo in calaamaduhu ku dhex dhuunto lakabka dielectric, sida ugu dhakhsaha badan ee gudbinta calaamadaha iyo khasaaraha yar.

Saxnimada wax-soo-saarka khadka gudbinta ayaa looga baahan yahay inuu sareeyo:

Gudbinta calaamadda-soo noqnoqda sare waa mid aad u adag oo loogu talagalay cilladda sifada ee fiilada daabacan, taas oo ah, saxnaanta wax-soo-saarka ee xariiqda gudbinta guud ahaan waxay u baahan tahay in cidhifka xariiqda gudbintu ay ahaato mid aad u nadiif ah, ma laha burr, dhejis, ama silig. buuxin.

Shuruudaha mashiinka:

Ugu horreyntii, walxaha guddiga microwave-sare ee soo noqnoqda ayaa aad uga duwan maro muraayadda epoxy ee guddiga daabacan;Marka labaad, saxnaanta mashiinka mashiinka mikrowave-sare ee soo noqnoqda ayaa aad uga sarreeya kan guddiga daabacan, iyo dulqaadka qaabka guud waa ± 0.1mm (haddii ay jirto saxnaanta sare, dulqaadka qaabka waa ± 0.05mm).

Cadaadis isku dhafan:

Isticmaalka isku dhafan ee substrate-soo noqnoqda sare (class PTFE) iyo substrate-xawaaraha sare (PPE class) waxay ka dhigaysaa guddiga xawaaraha-sare ee xawaaraha sare ma aha oo kaliya inuu leeyahay aag haynta weyn, laakiin sidoo kale wuxuu leeyahay joogto ah dielectric joogto ah, shuruudaha gaashaanka dielectric sare iyo iska caabin heerkul sare ah.Isla mar ahaantaana, ifafaalaha xun ee delamination iyo cadaadiska isku dhafan ee ay sababto kala duwanaanshaha adhesion iyo fidinta kulaylka ee u dhexeeya laba saxan oo kala duwan waa in la xalliyaa.

Labbiska sare ee daahan ayaa loo baahan yahay:

Caqabadda dabeecadda ee xariiqda gudbinta ee guddiga microwave ee inta jeer ee sarreeya waxay si toos ah u saameyneysaa tayada gudbinta ee calaamada microwave.Waxaa jira xiriir gaar ah oo u dhexeeya impedance sifo iyo dhumucda bireed naxaas ah, gaar ahaan loogu talagalay saxan microwave leh godad metallized, dhumucdiisuna waxay ma aha oo kaliya saamaynaysaa dhumucda guud ee bireed naxaas ah, laakiin sidoo kale saameeyaa saxnaanta silig ka dib etching. .sidaas darteed, cabbirka iyo lebbiska dhumucda dahaarka waa in si adag loo xakameeyaa.

Laser-ka-soo-saarka dalool-yar-yar:

Tilmaamaha muhiimka ah ee guddiga cufnaanta sare ee isgaadhsiinta waa daloolka yar-yar ee leh qaab dhismeedka daloolka indha la'aanta / aasan (daloolka ≤ 0.15mm).Waqtigan xaadirka ah, farsamaynta laysarka ayaa ah habka ugu muhiimsan ee samaynta godad yar-yar.Saamiga dhexroorka daloolka ilaa dhexroorka saxanka isku xidha ayaa ku kala duwanaan kara alaab-qeybiye ilaa alaab-qeybiye.Dhererka dhexroorka daloolka dhexroorka iyo saxanka isku xidha waxa uu la xidhiidha saxnaanta meelaynta ceelka, iyo lakabyada badan ee jira, way sii weynaan kartaa leexashadu.wakhtigan xaadirka ah, waxa inta badan la qaataa si loola socdo lakabka goobta la beegsaday.Xirmooyinka cufnaanta sare, waxaa jira saxan aan xiriir la lahayn oo dhex mara godadka.

Daaweynta dusha sare waa mid aad u adag:

Kordhinta soo noqnoqda, doorashada daaweynta dusha sare waxay noqotaa mid aad iyo aad muhiim u ah, iyo daboolka leh korantada wanaagsan ee korantada iyo dhuuban khafiifka ah ayaa leh saameynta ugu yar ee calaamadda."qallafsanaanta" ee siligga waa in ay la mid tahay dhumucda gudbinta ee calaamaduhu aqbali karto, haddii kale way fududahay in la soo saaro calaamad halis ah "mawjada taagan" iyo "milicsiga" iyo wixii la mid ah.Inertia molecular ee substrates gaar ah sida PTFE waxay adkeyneysaa in lagu daro foornada naxaasta ah, sidaas awgeed daaweynta dusha gaarka ah ayaa loo baahan yahay si loo kordhiyo qallafsanaanta dusha sare ama lagu daro filim dhejis ah oo u dhexeeya foil naxaas ah iyo PTFE si loo hagaajiyo adhesion.